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Environmentally robust electronics

Date

Thursday, March 26, 2026

Time

09:00 AM Europe/Zurich

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Agenda

Environmentally robust electronics
Protection mechanisms at chip level, for PCBs and complex assemblies

Electronic assemblies are generally at risk from environmental influences such as humidity, mechanical stress, temperature changes, corrosive chemicals, etc.

Various protective measures can be used to increase operational safety and service life, including conformal coatings, potting, glob top, underfilling and others.

The webinar will provide an overview of the principles of action, as well as areas of application and selection criteria for these types of protection, considering normative requirements and current technological developments.

The aim is to efficiently evaluate and implement suitable protection strategies for different application scenarios.

Dr. Bernd Schauwecker

Head of Engineering RHe Microsystems GmbH

Cicor Group