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Ways to protect electronics from environmental influences

Date

Thursday, March 26, 2026

Time

09:00 AM Europe/Zurich

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Agenda

Ways to protect electronics from environmental influences
Protection mechanisms at chip level, for PCBs and complex assemblies

Electronic assemblies are generally at risk from environmental influences such as humidity, mechanical stress, temperature changes, corrosive chemicals, etc.

Various protective measures can be used to increase operational safety and service life, including conformal coatings, potting, glob top, underfilling and others.

The webinar will provide an overview of the principles of action, as well as areas of application and selection criteria for these types of protection, considering normative requirements and current technological developments.

The aim is to efficiently evaluate and implement suitable protection strategies for different application scenarios.

Mr Thomas Schönfeld

Head of Technology
Cicor site in Dresden, Germany

Mrs Julia Stukert

Technology employee
Cicor site in Dresden, Germany

Mr Michael Paulik

Process Engineering
Cicor site in Dresden, Germany

Dr. Bernd Schauwecker

Head of Engineering RHe Microsystems GmbH

Cicor Group